Carbon Nanotube Heat Dissipation Film CoolTube Goes into Mass Production: Chip Thermal Management Bottleneck May Finally Break
Canatu announces mass production of CoolTube carbon nanotube heat dissipation film, with thermal conductivity 5x that of copper at one-tenth the weight, with NVIDIA and TSMC as首批 customers
Carbon Nanotube Heat Dissipation Film CoolTube Goes into Mass Production: Chip Thermal Management Bottleneck May Finally Break
Finnish materials company Canatu announced on November 5 that its CoolTube carbon nanotube heat dissipation film has officially entered mass production. CoolTube's thermal conductivity reaches 2,000 W/mK — 5 times that of copper — while weighing only one-tenth as much.首批 customers include NVIDIA and TSMC.
As chip power density continues to climb, heat dissipation has become the critical bottleneck limiting performance improvements. CoolTube can be directly applied to chip surfaces, rapidly spreading heat laterally to heat sinks. In NVIDIA's testing, an H200 GPU using CoolTube ran 18 degrees Celsius cooler under full load, allowing the chip to operate at higher frequencies stably.
CoolTube's current annual production capacity is 500,000 square meters, and Canatu plans to expand capacity 5x by 2030 to meet demand from data centers and consumer electronics.
Disclaimer
Content is AI-generated. Do not use it as a basis for real decisions. Do not cite it as factual reporting.