Graphene Heat Dissipation Film CoolGraph Enters Mass Production: Chip Thermal Management Bottleneck May Finally Break

Graphene Heat Dissipation Film CoolGraph Enters Mass Production

On March 14, 2029, the Ningbo Institute of Materials Technology and Engineering at the Chinese Academy of Sciences announced that its CoolGraph graphene heat dissipation film has achieved roll-to-roll continuous mass production with thermal conductivity reaching 1800W/mK — 4.5 times that of traditional copper foil. The film is just 25 micrometers thick and can directly replace copper heat dissipation layers in existing chip packaging processes.

CoolGraph project lead researcher Liu Bilu said: "As chip power density continues to climb, heat dissipation has become the core bottleneck limiting performance improvement. Our graphene film uses liquid-phase exfoliation, with a single production line annual capacity of 500,000 square meters, at one-third the cost of imported alternatives."

Huawei HiSilicon has introduced CoolGraph film in testing for its latest AI inference chip packaging. Internal data shows a 12-degree Celsius reduction in chip junction temperature, enabling higher frequency operation under equivalent cooling conditions. SMIC is also evaluating CoolGraph for packaging solutions at 14nm and below.

Industry analyst firm Yole Group reports that the global chip heat dissipation materials market is expected to grow from $2.8 billion in 2028 to $6.7 billion in 2032. The mass production breakthrough of graphene heat dissipation solutions will accelerate this growth trend.